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Infineon Hardware, PCB Design, Layout & Prototyping Services

Infineon Hardware, PCB Design, Layout & Prototyping Services

Adequate Infosoft provides custom Infineon hardware development services including PCB design, multilayer PCB layout, embedded firmware development, rapid prototyping, and production-ready electronic product engineering.

We partner with Infineon’s advanced semiconductor platforms (AURIX™, PSoC™, XMC™, TRAVEO™ and AIROC™) for automotive electronics, industrial automation, EV systems, smart energy products, motor control, and IoT.

The scope of our engineering services encompasses schematic design, high speed printed circuit board layout (PCB), RF/wireless hardware integration, power electronics design, battery management, Controller Area Network (CAN) communications, Linux embedded software, real-time operating system (RTOS) embedded firmware, PCB assembly, conformance testing, and validation.

We assist startups, OEMs, and industrial manufacturers to accelerate the embedded design and development cycle of Infineon-based hardware and firmware solutions from concept through to mass production by delivering proven, scalable, and reliable embedded product development options.

Advanced PCB circuit board hardware design and prototyping

4–8+ Layer PCB 5–7 Day Prototypes SiC & GaN Power

Our Infineon Hardware, PCB Development Services

We offer complete hardware and software development services for Infineon-based products throughout the entire product development cycle. We have expertise in firmware development, PCB design, embedded software development, mobile app integration, cloud infrastructure setup, IoT connectivity and custom software solutions for Infineon Semiconductor MCUs and platforms. We power companies to develop secure, scalable and high-performance smart devices and connected systems with Infineon technologies.

The right microcontroller selection is essential for achieving the goals of any project. Our engineers can help you determine which Infineon microcontroller will provide the best combination of performance to meet your needs based on several factors:

Processing Power & Memory

Processing power, memory, the ability to perform real-time functions Safety — ASIL A to ASIL D

Connectivity

CAN FD, Ethernet, LIN, FlexRay, Bluetooth Low Energy

Power Consumption

Extremely low power use for battery powered devices

Budgetary Considerations

How much money you have to spend for both prototype and production costs

Form Factor Limits

TQFP, LQFP and LFBGA are examples along with other considerations specific to your project

Our engineers provide you with a thorough comparative analysis of Infineon's different families within your product category. With this information, you will select an appropriate microcontroller prior to commencing any design work.

We generate production-ready schematics designed to work with Infineon processors, covering:

Processor connections: power supply, clock, reset and debug connections.
Peripheral connections: ADC, PWM, timers and communications interfaces.
Memory extension: external Flash/RAM and storage interfaces.
Power Management: PMIC selection, DC/DC converters, LDOs for multiple voltages.
Circuit protection: ESD protection; Overcurrent protection; Reverse polarity protection.

Designs follow Infineon's guidelines, for supply decoupling, oscillators and unused pins, to provide optimal EMC behaviour.

Infineon's AURIX™ and TRAVEO™ families operate at high frequencies, requiring meticulous PCB layout. Our layout services are guided by Infineon's official PCB design guidelines for high-speed serial interfaces (HSSI) such as Ethernet, FlexRay, and high-speed SPI.

Service Category	Specific Offerings
Stack-up Design	4, 6, 8+ layer boards optimized for signal integrity
Controlled Impedance	50Ω single-ended, 100Ω differential pair routing
High-Speed Routing	DDR memory, Ethernet, USB, LVDS, MIPI
Power Distribution	Low-inductance PDN design, plane capacitance optimization
Decoupling Strategy	Optimal capacitor placement for frequencies up to 200MHz

Critical Design Rules We Follow

Infineon's design guidelines emphasize several critical principles that we strictly implement:

Trace impedance control — High-speed traces must maintain 50Ω impedance (microstrip or stripline configuration)
Solid ground reference — Never route high-speed signals over split planes
Short trace lengths — Critical length calculation based on signal rise time
Minimal vias — Layer changes introduce impedance discontinuities
45° bends — Never use 90° bends for high-speed signals
Differential pair routing — Maintain consistent spacing and length matching

Example Critical Length Calculation (FR4 material, 500ps rise time)

Propagation velocity:14.8 cm/ns

Distance at rise time:7.4 cm

Critical length:1.85 cm — any trace longer requires controlled impedance

Infineon's leadership in power semiconductors requires specialized design expertise. By integrating SiC and GaN power devices with Infineon gate drivers and microcontrollers, we deliver high-performance, low-cost solutions for:

By integrating SiC and GaN, their power devices to the Infineon gate drivers and microcontrollers for Electric Vehicles (e.g., traction inverters, on-board chargers (OBC), DC-DC converters), Solar Inverters (i.e., high efficiency MPPT tracking and grid-tie inverters), EV fast chargers (from 50kW to 350kW of charging infrastructure), and industrial motor drive (e.g., BLDC, PMSM and induction motor control) designs, gives Infineon the ability to deliver high-performance, low-cost solutions to the users of their products.

Mixed Signal Design Capabilities — Power Electronics
 High-voltage SiC/GaN isolated gate driver layouts
 Analog front-end design capability for precision sensing
 EMI/EMC optimization for switching power stage designs
 Thermal management as it relates to PCB design (e.g., copper pours and thermal vias)

We offer both small-batch prototyping for testing purposes and larger-scale manufacturing for commercial release. Our rapid prototype offerings take full advantage of the Infineon Development ecosystem with the following key elements:

Build on the Infineon Evaluation Board by adapting it into a reference design
Make PCBs quickly (5–7 day turnaround)
Source authentic Infineon components using authorized sources
Assemble PCBs using automated SMD pick and place equipment for fine pitch components (TQFP, LFBGA)
Conduct board level functional tests prior to shipping

Additional Prototyping Services

Power on test and verify power rails
Boundary scan to test BGA packages
Flash appropriate firmware and perform basic functionality tests
Environmental Testing (temp & humidity) when applicable

Case Study: 3kW BLDC Motor Controller Board

Industrial motor control PCB circuit board hardware

Industrial Motor Control · Infineon XMC4500

Client and Problem Statement

A manufacturer of industrial pumps required a complete controller for their 3kW brushless DC (BLDC) motors. The requirements for the controller were:

Fully integrated power with on-board sensorless F.O.C. (Field-Oriented Control) for maximum efficiency

Capable of operating in a rugged industrial environment (−20°C to +70°C)

Designed for CAN Bus connection for integration into existing systems (either as a stand-alone controller or as part of an existing pump)

Compact size (100mm width by 80mm depth)

Our Solution: Hardware Development

Processor & Component Selection

Selected Infineon XMC4500 (Cortex-M4 @120MHz) – ideal for motor control with high-resolution PWM and fast ADC
Power stage: Infineon IPW60R040CFD7 CoolMOS™ MOSFETs
Gate driver: Infineon 6EDL7141 – three-phase gate driver with integrated protection
Current sensing: Three-shunt resistors + Infineon TLE4972 magnetic current sensors

Schematic Design

Complete motor control power stage design
Isolated CAN transceiver (ISO1042) for industrial noise immunity
Auxiliary power supply from 48V DC bus
Protection circuitry: overcurrent, overtemperature, undervoltage lockout

PCB Layout (6-layer board)

Layer stack: Signal-GND-Power-Power-GND-Signal
Controlled impedance for CAN (120Ω differential)
Power stage layout with minimized switching loops
Thermal management: Copper pours and thermal vias under MOSFETs
Decoupling capacitors placed per Infineon's guidelines

Prototyping & Assembly

5-unit prototype run with quick-turn fabrication (7 days)
Full PCBA assembly with SMD components
Automated optical inspection (AOI) for quality verification

Validation

Power-on testing: all voltage rails verified
Functional testing: PWM generation, ADC reading, CAN communication
Load testing: 3kW operation at 48V, 62.5A
Thermal testing: MOSFET temperature within limits at full load
EMC pre-compliance: passed radiated emissions testing

Output

First-Pass Success

The five prototype boards had successful first pass operations. When these prototypes were used as replacements for existing boards, they delivered absolutely no mechanical noise (20 kHz PWM switching) during pump operation.

Peak efficiency (95% maximum peak efficiency) was achieved through optimal design of the power stage and a total of eight weeks from architecture to paper prototypes were delivered.

Production-ready designs were transitioned from the design team to manufacturing in terms of the design files and bill of materials (BOM).

Technologies Used in This Case

Component	Specification
Processor	Infineon XMC4500 (Cortex-M4F, 120MHz)
Power Stage	6x IPW60R040CFD7 MOSFETs
Gate Driver	Infineon 6EDL7141
Current Sensing	Infineon TLE4972 (x3)
PCB	6-layer, 100x80mm, 2oz copper on power layers
Assembly	Full SMD + through-hole, conformal coating

Infineon Hardware Families We Master

Our hardware expertise spans the entire Infineon portfolio. Below is every major family we work with:

AURIX™ Family – Automotive & Safety-Critical Applications

The AURIX™ TC2xx and TC3xx series are 32-bit TriCore™ microcontrollers designed for the highest safety standards (ASIL-D).

Series	Key Features	Applications
TC3xx	Up to 6 cores @300MHz, 16MB Flash, ASIL-D	EV traction inverters, ADAS, domain controllers, BMS
TC2xx	Up to 3 cores @200MHz, 4MB Flash, ASIL-D	Engine control, transmission, chassis, airbag systems

Expertise with Hardware AURIX™:

Package support - TQFP-80/100/144, LQFP-144/176, LFBGA-180/292
Power supply design - VDD(1.25 V core), VDDP3(3.3 V flash), VEXT(3.3 V/5 V), VDDM(ADC supply)
Decoupling strategy - 100nF and 330nF capacitor placement based on Infineon recommendations
Oscillator circuit design - Separately grounded islands to reduce emissions from oscillator circuits.
Unused pin handling - Appropriate termination to meet EMC limits (800 V/m field strength limit at 6.7 mm distance).

PSoC™ Family – Flexible, Mixed-Signal MCUs

The PSoC™(Programmable System-on-Chip) family combines Arm® Cortex®-M cores with programmable analog and digital blocks.

Series	Key Features	Applications
PSoC™ 4	Cortex-M0, CapSense®, programmable analog	Consumer HMI, touch interfaces
PSoC™ 6	Dual-core M4/M0+, BLE, ultra-low-power	IoT sensors, wearables, medical devices
PSoC™ Edge	ML acceleration, DSP instruction set	Edge AI, predictive maintenance
PSoC™ Control C3	Real-time control	Industrial motor drives, power conversion

Our PSoC™ Hardware Expertise:

CapSense® touch interface PCB design (sensitivity optimization)
BLE antenna layout and impedance matching
Low-power design for battery-operated devices

XMC™ Family – Industrial & Power Conversion

The XMC1000 (M0) and XMC4000 (M4) series target industrial applications requiring real-time control.

Key Applications:

Motor Drives

Industrial motor drives (BLDC/PMSM)

Power Conversion

Power supplies and converters

Factory Automation

Factory automation controllers

Building Automation

Building automation systems

Body Electronics & Clusters from the TRAVEO™ Family

The TRAVEO™ T2G Series Body, Cluster Products Feature the Arm Cortex-M4/M7 Cores Suitable for Instrument Clusters, Human-Machine Interfaces (HMIs) and Body Control Modules.

Power Management and System Basis Chips

Infineon has Integrated Power Management Products including:

System Basis Chips

Combined Power Supply and CAN/LIN Transceiver in a single package

Gate Drivers

GD3160, GD3162 for IGBT/SiC Traction Inverters

Battery Management ICs

Cell Monitoring and Balancing for EV and energy storage

Technical Design Guidelines We Follow

Infineon provides comprehensive PCB design guidelines that our team strictly implements. Key principles include:

Decoupling Capacitor Placement

On-board decoupling capacitors effective from 1 MHz – 200 MHz
Above 200 MHz, plane capacitance provides decoupling
Capacitors placed as close as possible to IC pins
Vias placed close to capacitor pads to reduce parasitic inductance
X7R ceramic capacitors used for temperature stability

Identification of Significant Signals

The following signals have to be treated with caution when designing the layout of any PCBs that contain these signals:

ERAY pins — FlexRay communications
DAP — Debug Access Port
Ethernet pins — High speed networking
QSPI pins — High speed serial communications
Exterior Clock Pins — Timing of the entire system
SYSCLK Pin — System clock output
Supply Pins — Power Distribution

Designing the Ground Plane

Need to have a continuous solid ground reference underneath all of the high-speed signals
Don't cut the ground plane with via groups
Ensure that return currents can flow near signal lines
20xH. You want to eliminate as much as 20x the thickness of the board worth of metal from the edges of power planes to limit radiated energy from the plane edges.

Unused Pin Handling

Infineon's guidelines specify proper handling of unused pins for EMC compliance:

Pin Type	Recommended Termination
I/O Pins	Static low output in weakest driver mode (≤800 V/m at 6.7mm)
Input Pins (no pull device)	Connect to GND via 10k–1MΩ resistor (<1 pF coupling)
Input Pins (with pull device)	Configure as pull-up/pull-down via software

Oscillator Circuit Design

Separate ground island on GND layer for oscillator circuit
Connect island at single point to main GND
Load capacitors placed as short as possible to XTAL pins
Ground connections of load capacitors connected to oscillator island

Start Your Infineon Hardware Project With Adequate Infosoft

If you require:

A full Designer produced Infineon product (from idea to finished product)
PCB layout and prototype to your current schematic
Consulting services on processor selection and board level architecture
Design transfer, production assistance and support for your product manufacturing

Contact Adequate Infosoft for a technical consultation. Share your requirements, and our Infineon hardware specialists will provide a detailed assessment and proposal.

Get a Free Technical Consultation Send Your Requirements

Leadership That Leads Worldwide

With a physical presence in over 15 countries and a global footprint spanning 25+ countries, we are ready to serve you anywhere. Location, language, or culture is never a barrier, because our global team can work with you in your language. Our strong international team ensures seamless collaboration across borders We have a strong tech team, highly recognized in their domains, with extensive technical expertise.

Infineon Hardware, PCB Design, Layout & Prototyping Services

Our Infineon Hardware, PCB Development Services